The heatsink is the necessary device to cool the power semiconductor device such as disc type and module type thyristor and diode by forced air or water. In order to maintain the normal and reliable performance, it is necessary to choose a suitable heatsink and assemble it properly. The main methods and cautions of assemble heatsinks are following:

1. Make sure the polarity of the assembly is correct (see the installation pictures of various heatsink), the accessories are complete, and the pressure meets the regulations (see the table below), if there is a fan, the direction of the fan should be correct.

2. The length of the screw is moderate, and after the tightening pressure is applied, the screw protrudes 2-3 teeth from the nut is proper.

3. Insulation parts are intact without cracks nor damage.

4. The distance between copper bars is complied with standards (see the table below), and the proper distance between the fins of SF series air-cooled heatsink is 14-18mm.

4.1 Distance between copper bars of SF series

4.2 Distance between copper bars of SS series

5. For air-cooled heatsink, the upper and lower heatsink pair should be aligned neatly and straightly. For water-cooled heatsink, the upper and lower copper bars should be aligned and perpendicular to the mounting plate

6. Jiangsu Yangjie Runau Semiconductor will conduct the entire inspection of each components and assembly for normal temperature withstand voltage and VGT/IGT parameters before delivery.

The above mentioned methods and cautions are the normal conditions to assemble the air-cooled and water-cooled heatsink. If any special requirement from the customer, please contact with us feel free. At the same time, in order to ensure the reliable performance of application, especially for the requirement of high power thyristor and high power diode , please consult with the sale forces of Jiangsu Yangjie Runau Semiconductor Co, for the special suggestion and reliable high quality device.